Innovative Analytics and Cloud-Based Technologies to Be Showcased at Semicon China 2021

 

SHENZHEN, China— BISTel, a global leader in engineering automation systems (EES) and AI-driven smart manufacturing, is set to unveil its latest innovations tailored for China’s semiconductor sector. At the upcoming Semicon China exposition in Shanghai from March 17–19, 2021, the company will showcase Big Data-Driven Smart Analytical Solutions Designed for China’s Semiconductor Manufacturing, a strategic initiative aimed at revolutionizing chip production efficiency and quality control in the region.

During the Smart Manufacturing Forum on March 18, 2021, Senior Director Wang Feng will introduce a suite of cutting-edge smart analytics solutions designed to enhance production efficiency, reduce costs, and optimize semiconductor manufacturing processes in China’s rapidly expanding market.

 

AI-Powered Fault Detection and Root Cause Analysis

One of the key highlights of the event will be the next-generation Fault Detection and Classification (FDC) system, a real-time analytics tool that enhances defect identification and production accuracy. The company will also introduce an updated eDatalyzer® suite, an advanced machine learning-based root cause analysis tool that rapidly detects and resolves semiconductor yield issues.

These innovations are designed to proactively identify failures before they occur, helping manufacturers improve yield rates and minimize costly production downtimes.

 

Cloud-Based Smart Manufacturing Solutions

BISTel is also taking a cloud-first approach to semiconductor manufacturing with the introduction of dynamic fault detection (DFD) technology. Unlike traditional fault detection methods that require significant infrastructure investments, DFD offers cost-effective, cloud-based access to state-of-the-art fault detection tools.

This shift to cloud-based solutions provides manufacturers in China with scalable, high-performance analytics without the burden of heavy infrastructure costs. By leveraging cloud technologies, semiconductor companies can optimize production without extensive hardware investments, enabling greater flexibility and operational efficiency.

 

Revolutionizing Semiconductor Assembly with Optimus Edge

Beyond front-end semiconductor manufacturing, BISTel is also innovating in the back-end test, assembly, and packaging segment. The introduction of Optimus Edge solutions marks a major leap in wire bonding and semiconductor packaging. These first-of-their-kind edge devices are designed to cut infrastructure costs while boosting machine performance in semiconductor packaging and assembly processes.

The Optimus Edge solutions offer real-time monitoring and predictive analytics, ensuring equipment operates at peak efficiency while minimizing unexpected failures. This advancement is expected to reshape semiconductor packaging efficiency by reducing manual intervention and increasing automation.

 

Empowering China’s Semiconductor Future

As China’s semiconductor industry experiences rapid expansion, BISTel is positioning itself as a key enabler of smart manufacturing transformation.

"We are pleased to introduce semiconductor smart analytics solutions tailored to China’s unique needs," said W.K. Choi, CEO of BISTel. "Whether deployed on-premises or in the cloud, our AI-driven process control automation solutions help chipmakers improve yields, reduce costs, and enhance their competitiveness in the global semiconductor market."

With more than 395 employees worldwide, BISTel is a recognized leader in intelligent manufacturing solutions, catering to industries such as semiconductors, flat panel displays, automotive, and pharmaceuticals.

By combining AI, big data analytics, and cloud computing, BISTel aims to drive the next phase of semiconductor manufacturing evolution, empowering China’s chipmakers with state-of-the-art automation technologies that enhance production efficiency, reduce downtime, and improve overall equipment effectiveness.

For more details, visit bistel.com.